HiSilicon Kirin 810

HiSilicon Kirin 810 is a mid-range 64-bit system on a chip (SoC) for smartphones and other mobile devices designed by HiSilicon and announced in 2019.

Kirin 810 includes CPU with ARMv8.2-A (64-bit) architecture which contains eight computing cores. They are distributed in two clusters as follows:

  • 2 x ARM Cortex-A53 @ 2.27 GHz
  • 6 x ARM Cortex-A53 @ 1.88 GHz

HiSilicon Kirin 810 specifications

Main info

Vendor
HiSilicon
Released
January 2019
Class
Middle-end
Manufacturing Process
7 nm FinFET

processor

Architecture
ARMv8.2-A (64-bit)
Cores count
Octa-core
CPU cores
2 x ARM Cortex-A53 @ 2.27 GHz
6 x ARM Cortex-A53 @ 1.88 GHz
64-bit
Yes
NPU
No

Memory

RAM support
LPDDR4X @ 1866 MHz (Dual Channel)
ROM support
eMMC 5.1

Graphics

GPU
ARM Mali-G52 MP6 @ 820 MHz

Mobile networks

LTE support
Yes
LTE categories
Category-12 DL / Category-13 UL
LTE maximum download speed
600 Mbps
LTE maximum upload speed
150 Mbps

Communications

Wi-Fi
IEEE 802.11 a/b/g/n/ac
Wi-Fi ranges
2.4 GHz + 5.0 GHz
Bluetooth
v5.0

Smartphones based on HiSilicon Kirin 810

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