HiSilicon Kirin 970

HiSilicon Kirin 970 is a high-end 64-bit system on a chip (SoC) for smartphones and other mobile devices designed by HiSilicon and announced in 2017.

Kirin 970 includes CPU with ARMv8-A (64-bit) architecture which contains eight computing cores. They are distributed in two clusters as follows:

  • 4 x ARM Cortex-A73 @ 2.36 GHz
  • 4 x ARM Cortex-A53 @ 1.84 GHz

HiSilicon Kirin 970 specifications

Main info

Vendor
HiSilicon
Released
January 2016
Class
High-end
Manufacturing Process
10 nm FinFET+ TSMC

processor

Architecture
ARMv8-A (64-bit)
Cores count
Octa-core
CPU cores
4 x ARM Cortex-A73 @ 2.36 GHz
4 x ARM Cortex-A53 @ 1.84 GHz
64-bit
Yes
NPU
Yes

Memory

RAM support
LPDDR4x @ 1866 MHz (Dual Channel)
ROM support
UFS 2.1

Graphics

GPU
ARM Mali-G72 MP12 @ 746 MHz

Mobile networks

LTE support
Yes
LTE categories
Category-18 DL / Category-13 UL
LTE maximum download speed
1200 Mbps
LTE maximum upload speed
200 Mbps

Communications

Wi-Fi
IEEE 802.11 a/b/g/n/ac
Wi-Fi ranges
2.4 GHz + 5.0 GHz
Bluetooth
v5.0

Smartphones based on HiSilicon Kirin 970

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